ChipMOS TECHNOLOGIES INC.
As of Oct 22, 2026, ChipMOS TECHNOLOGIES is in Stage 2, the uptrend phase, now in week 3 (since Oct 7, 2026). It closed at $55.46, 33.4% below its 52-week high and above its 200-day average, which is rising.
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of Ch… More about the company
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Setup-score rank among Stage 2 peers: #1 of 23 in Semiconductors · #1 of 242 in Information Technology
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IMOS among Semiconductors5th of 68 by relative strength
All 68 →| # | Stock | Stage | RS | 1M |
|---|---|---|---|---|
| 1 | MU | Stage 2 · wk 4 | 99 | −20.1% |
| 2 | MXL | Stage 2 · wk 3 | 98 | −22.6% |
| 3 | ASX | Stage 2 · wk 3 | 98 | −14.1% |
| 4 | UMC | Stage 2 · wk 3 | 97 | −24.9% |
| 5 | IMOS | Stage 2 · wk 3 | 97 | −17.7% |
| 6 | MRVL | Stage 2 · wk 4 | 97 | −14.3% |
| 7 | AMD | Stage 2 · wk 4 | 96 | −17.4% |
| 8 | TSEM | Stage 3 · wk 12 | 96 | −27.2% |
ChipMOS TECHNOLOGIES: quick answers
What stage is ChipMOS TECHNOLOGIES in?
As of Oct 22, 2026, ChipMOS TECHNOLOGIES (IMOS) is in Stage 2, the uptrend phase. It entered Stage 2 on Oct 7, 2026 and is in week 3. What the four stages mean
Is ChipMOS TECHNOLOGIES in an uptrend?
Yes. ChipMOS TECHNOLOGIES is in a Stage 2 uptrend. It trades 7.1% above its 200-day average, which is rising.
How far is ChipMOS TECHNOLOGIES from its 52-week high?
ChipMOS TECHNOLOGIES closed at $55.46 on Oct 22, 2026, 33.4% below its 52-week high of $83.30. Its 52-week low is $20.09.
How has ChipMOS TECHNOLOGIES performed over the past year?
As of Oct 22, 2026, ChipMOS TECHNOLOGIES is up 173.1% over the past year and up 84.0% so far in 2026.
Which sector and industry is ChipMOS TECHNOLOGIES in?
ChipMOS TECHNOLOGIES is in the Semiconductors industry, part of the Information Technology sector.
About this companyInformation Technology· Semiconductors
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, and internationally. It operates through five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. The company offers leadframe-based packages, such as the small outline package, thin small outline package, and quad flat package; and substrate-based packages, including FBGA, VFBGA, stacked chip-scale package, TFBGA, LGA, COG, and COF; and testing solutions comprising professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot run arrangement, engineering support, device failure mode analysis, and automation system for simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC devices. It also provides bumping services; intellectual property management and enabling technologies; and turnkey services, such as wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment to display driver IC, memory IC, and logic mixed-signal IC. The company serves fabless companies, integrated device manufacturers, and foundries. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
Visit company website →All analytics based on EOD data. Data as of 2026-10-22. Past data patterns are not indicative of future results. This page is a data analytics tool only.